5G Premium Smart Module SC171

Fibocom SC171 is a 5G premium smart module powered by the Qualcomm QCM6490 chipset platform. It features an Octa-core and a high-performance graphics engine to allow smooth 4K video playing and multi-channel camera input.The module is positioned to provide optimal wireless solution to high-end AIoT market with computing capability up to 12 TOPS.

The Fibocom SC171 module, enhanced by the powerful Qualcomm QCM6490 chipset, marks a significant advancement in 5G connectivity solutions tailored for the AIoT sector. This module boasts a sophisticated Octa-core processor and advanced graphics engine capable of supporting 4K video displays and handling multiple camera inputs efficiently, making it ideal for applications requiring intensive multimedia processing and multi-thread operations.

Utilizing the Qualcomm QCM6490 platform, the SC171 supports dynamic 5G capabilities including both NSA and SA architectures, ensuring wide compatibility and future-proofing for global network technologies. This module is backward compatible with 4G and 3G networks, enhancing its versatility across different geographic and network environments.

The module's high-performance multi-constellation GNSS receiver enhances location services, making it suitable for complex navigation and tracking applications, which are critical in sectors like logistics and automotive. The inclusion of dual-band Wi-Fi, Bluetooth technology, and Wi-Fi 6 compatibility underscores its capability to handle high-throughput, low-latency applications.

Designed with flexibility in mind, the SC171 includes a variety of interfaces such as MIPI, USB, UART, SPI, and I2C, allowing seamless integration into diverse IoT ecosystems. This makes it exceptionally well-suited for a broad range of AIoT applications, including industrial handheld devices, security systems, body-worn cameras, mobile DVRs, and even robotics.

By leveraging the Qualcomm QCM6490, the SC171 not only ensures robust processing power of up to 12 TOPS but also positions itself as a pivotal element in powering next-generation smart devices that require intensive computational capabilities and advanced connectivity features.